| 摘要 |
A system for monitoring a connection to an active pin of an integrated circuit (IC) die, includes an input/output (I/O) cell of an IC die, where the I/O cell is bonded to a bonding pad on a ball grid array (BGA) substrate. The system includes a test point on a printed circuit board (PCB) coupled to the bonding pad which forms an electrical/conductive pathway between the test point and the I/O cell. The system includes a clock waveform injected through a resistor into the test point. |
