<p>The present invention provides an encapsulating resin composition that is excellent in terms of thermal expansion coefficient and flowability and that can easily penetrate into a narrow gap. The encapsulating resin composition includes an epoxy resin, a curing agent, inorganic particles, an organic titanium compound and a phosphoric acid ester. The average particle diameter of the inorganic particles is about 10 µm or less. The amount of inorganic particles relative to a total amount of the composition is about 60 percent by mass or more. The amount of organic titanium compound relative to the total quantity of the composition is about 1 percent by mass or more and about 5 percent by mass or less. The amount of phosphoric acid ester relative to the total quantity of the composition is about 0.5 percent by mass or more and about 3 percent by mass or less.</p>
