Package substrate and semiconductor package

摘要

PURPOSE: A package substrate and a semiconductor package using the same are provided to intensify a supporting force of a wire by forming a dam structure in an inner side of a bonding finger. CONSTITUTION: A semiconductor chip(210) is mounted in a first surface. A second surface is formed on an opposite direction to the first surface. A plurality of bonding fingers(202) is arranged in an edge of the first surface. A plurality of dam structures(230) is arranged in an inner side of the bonding finger. The dam structure is made of an insulating material.