发明名称 GRINDING APPARATUS, AND METHOD FOR MANUFACTURING ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a grinding apparatus that controls the displacement of a workpiece during grinding the workpiece and can accurately grind the workpiece, and to provide a method for manufacturing an electronic part, which uses a method using the grinding apparatus. <P>SOLUTION: The method for manufacturing an electronic part includes the steps of: storing the workpiece one by one in a storage space of a career rotationally moving in a carriage direction; pressing the workpiece against an immovable stopper side wall by blowing air to the workpiece from the rotating career, while rotationally moving the storage space, in which the workpiece is stored, in the carriage direction; and forming a core by moving the storage space in which the workpiece is stored, in the carriage direction, while blowing air to the workpiece to press the workpiece against the stopper side wall, making a grinding device enter the storage space in a grinding area to bring the grinding device into contact with the outer periphery surface of the workpiece, and processing the workpiece while rotating the workpiece so as to form a recessed groove. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012024894(A) 申请公布日期 2012.02.09
申请号 JP20100167140 申请日期 2010.07.26
申请人 TDK CORP 发明人 SOMA MANABU;KUNII YOSHIKI;KAWAGOE MASABUMI;SAITO RYOJI
分类号 B24B5/20;B24B41/06 主分类号 B24B5/20
代理机构 代理人
主权项
地址