发明名称 LASER BEAM MACHINING DEVICE, METHOD FOR MACHINING WORKPIECE, AND METHOD FOR DIVIDING THE WORKPIECE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser beam machining device which suppresses formation of machining marks, and further can form division starting points more securely achieving the division of the workpiece. <P>SOLUTION: The laser beam machining device includes: a light source emitting pulse laser beams; and a stage on which a workpiece is placed. The device further includes a cooling mechanism for cooling the placement face of the workpiece placed on the stage. In a state where the workpiece is placed on the stage, and also, the placement face is cooled by the cooling mechanism, while moving the stage so that the regions to be irradiated per unit pulse beam of the pulse laser beams are discretely formed in the face to be machined opposed to the mounting face, the pulse laser beams are emitted on the workpiece. In this way, the cleavages or partings of the workpiece are successively caused between the regions to be irradiated to form starting points for division in the workpiece. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012024815(A) 申请公布日期 2012.02.09
申请号 JP20100166229 申请日期 2010.07.23
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 NAGATOMO SHOHEI;NAKATANI IKUYOSHI;SUGATA MITSURU
分类号 B23K26/38;B23K26/40;B28D5/00 主分类号 B23K26/38
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