发明名称 LASER MACHINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To fix machining conditions for a laser beam with respect to the machining depth of an object to be machined. <P>SOLUTION: A laser machining apparatus 1 is provided for laser machining the object 2 to be machined. The laser machining apparatus includes: a laser beam source 12 for emitting a laser beam L; an optical device 14 for condensing the laser beam to the object to be machined and correcting aberration according to the predetermined optical path length which is longer than the optical path length from the laser beam incident face of the object to be machined to the machining depth in the laser beam; and an aberration adding device 15 disposed in the optical path of the laser beam between the optical device and the object to be machined, for adding aberration according to the optical path length difference between the predetermined optical path length of the object to be machined and the optical path length from the laser bean incident face of the object to be machined to the machining depth. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012024787(A) 申请公布日期 2012.02.09
申请号 JP20100163839 申请日期 2010.07.21
申请人 PIONEER ELECTRONIC CORP;PIONEER FA CORP 发明人 MOCHIZUKI MANABU;ITAMOCHI MITSURU;HIROTA HIROYOSHI
分类号 B23K26/06;B23K26/00;B23K26/38 主分类号 B23K26/06
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