发明名称 |
LASER MACHINING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To fix machining conditions for a laser beam with respect to the machining depth of an object to be machined. <P>SOLUTION: A laser machining apparatus 1 is provided for laser machining the object 2 to be machined. The laser machining apparatus includes: a laser beam source 12 for emitting a laser beam L; an optical device 14 for condensing the laser beam to the object to be machined and correcting aberration according to the predetermined optical path length which is longer than the optical path length from the laser beam incident face of the object to be machined to the machining depth in the laser beam; and an aberration adding device 15 disposed in the optical path of the laser beam between the optical device and the object to be machined, for adding aberration according to the optical path length difference between the predetermined optical path length of the object to be machined and the optical path length from the laser bean incident face of the object to be machined to the machining depth. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012024787(A) |
申请公布日期 |
2012.02.09 |
申请号 |
JP20100163839 |
申请日期 |
2010.07.21 |
申请人 |
PIONEER ELECTRONIC CORP;PIONEER FA CORP |
发明人 |
MOCHIZUKI MANABU;ITAMOCHI MITSURU;HIROTA HIROYOSHI |
分类号 |
B23K26/06;B23K26/00;B23K26/38 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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