发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER DEVICE AND LIGHT APPARATUS |
摘要 |
A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves. |
申请公布号 |
US2012033701(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201113274710 |
申请日期 |
2011.10.17 |
申请人 |
BESSHO YASUYUKI;OHBO HIROKI;TAKEUCHI KUNIO;TOKUNAGA SEIICHI;KUNOH YASUMITSU;HATA MASAYUKI;SANYO ELECTRIC CO., LTD. |
发明人 |
BESSHO YASUYUKI;OHBO HIROKI;TAKEUCHI KUNIO;TOKUNAGA SEIICHI;KUNOH YASUMITSU;HATA MASAYUKI |
分类号 |
H01S5/026 |
主分类号 |
H01S5/026 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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