发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER DEVICE AND LIGHT APPARATUS
摘要 A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves.
申请公布号 US2012033701(A1) 申请公布日期 2012.02.09
申请号 US201113274710 申请日期 2011.10.17
申请人 BESSHO YASUYUKI;OHBO HIROKI;TAKEUCHI KUNIO;TOKUNAGA SEIICHI;KUNOH YASUMITSU;HATA MASAYUKI;SANYO ELECTRIC CO., LTD. 发明人 BESSHO YASUYUKI;OHBO HIROKI;TAKEUCHI KUNIO;TOKUNAGA SEIICHI;KUNOH YASUMITSU;HATA MASAYUKI
分类号 H01S5/026 主分类号 H01S5/026
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