发明名称 |
INK COMPOSITION FOR FORMING LIGHT SHIELDING FILM OF ORGANIC SEMICONDUCTOR DEVICE, METHOD FOR FORMING LIGHT SHIELDING FILM, AND ORGANIC TRANSISTOR DEVICE HAVING LIGHT SHIELDING FILM |
摘要 |
There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200° C. or less and a liquid resin that is in a liquid state at 10 to 50° C. at a ratio (solid resin/liquid resin) of 0.2 to 0.6. |
申请公布号 |
US2012032309(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201013000918 |
申请日期 |
2010.04.26 |
申请人 |
ETORI HIDEKI;ISOZUMI HIROSHI;KASAI MASANORI;DIC CORPORATION |
发明人 |
ETORI HIDEKI;ISOZUMI HIROSHI;KASAI MASANORI |
分类号 |
H01L21/302;C08K5/101;H01L51/05 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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