发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 Provided are a semiconductor integrated device and a method for fabricating the same. The semiconductor integrated circuit includes a semiconductor substrate including a first dopant, a first conductive layer pattern formed on the semiconductor substrate, an interlayer dielectric layer formed on the first conductive layer pattern, a second conductive layer pattern formed on the interlayer dielectric layer, and a first vacuum ultraviolet (VUV) blocking layer which blocks a VUV ray radiated to the semiconductor substrate.
申请公布号 US2012032269(A1) 申请公布日期 2012.02.09
申请号 US201113272675 申请日期 2011.10.13
申请人 CHANG DONG-RYUL;LEE TAE-JUNG;KIM SUNG-HOAN;LEE SOO-CHEOL;SAMSUNG ELECTRONICS CO., LTD. 发明人 CHANG DONG-RYUL;LEE TAE-JUNG;KIM SUNG-HOAN;LEE SOO-CHEOL
分类号 H01L29/78 主分类号 H01L29/78
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