发明名称 AFFIXING FITTING FOR COMPONENT MOUNTED TO CIRCUIT BOARD
摘要 <p>The purpose of the present invention is to provide an affixing fitting that is for a component mounted to a circuit board, and that is capable of exerting a high bonding strength by means of being capable of holding a sufficient quantity of solder at the entire surface of a solder-bonding surface, even if the surface area of a solder-bonding plate does not change. The affixing fitting has: a solder bonding plate (11) that is soldered/affixed to the surface of the circuit board using cream solder; and a component affixing section (12) that is affixed to a connector that is to be mounted on the circuit board. V-grooves (13) that, by means of the capillary effect, draw in cream solder applied of the surface of the circuit board are formed at the solder-bonding surface at the bottom surface (11B) of the solder bonding plate (11), and a plurality of through-holes (14) that interconnect with the tapered portion of the V-grooves and that are capable of drawing in the cream solder by means of the capillary effect are pierced from the upper surface (11A) towards the bottom surface (11B) of the solder bonding plate (11) and spaced in the direction that the V-grooves (13) extend.</p>
申请公布号 WO2012017997(A1) 申请公布日期 2012.02.09
申请号 WO2011JP67628 申请日期 2011.08.01
申请人 YAZAKI CORPORATION;MURO TAKASHI 发明人 MURO TAKASHI
分类号 H01R12/57 主分类号 H01R12/57
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