| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily manufacture a chip with desired thickness. <P>SOLUTION: In a method for manufacturing a chip obtained by forming a function element 15 on a substrate, laser lights L are first focused on a workpiece 1, so as to form a reformed area 7a along a surface 3 at a predetermined depth position corresponding to a substrate thickness H from the surface 3 of the workpiece 1. A reformed area 7b extending corresponding to a side edge of the substrate 11 seen from the surface 3 is formed on the surface 3 of a workpiece 1 to connect to the reformed area 7a along a Z-direction. Then, after the function element 15 is formed on the surface 3 of the workpiece 1, etching is selectively extended along the reformed areas 7a, 7b, so as to cut one part of the workpiece 1 as a substrate of the chip. Thereby, without making the workpiece thin by grinding, the chip having a desired thickness is formed, so as to facilitate handling of the workpiece 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
