| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently manufacture an electronic component including a plurality of ceramic laminates of different lamination directions. <P>SOLUTION: A manufacturing method of a laminated electronic component includes: a process of forming a first laminated sheet for which an insulating function layer comprising an unbaked ceramic material and a conductor layer in which a plurality of conductors configuring a part of a circuit element are arrayed laterally and longitudinally are laminated; a process of forming a second laminated sheet similarly; a process of obtaining first laminated sticks by cutting the first laminated sheet in a bar shape; a process of obtaining second laminated sticks by similarly cutting the second laminated sheet; a process of obtaining a third laminated sheet by rotating the second laminated sticks for 90°, disposing them so as to be held between the first laminated stick and the first laminated stick, subjecting them to thermocompression bonding, and integrating them; a process of turning the third laminated sheet into chips by laterally and longitudinally cutting the third laminated sheet so as to include a first laminate which is a part of the first laminated stick and a second laminate which is a part of the second laminated stick in each of them; and a process of obtaining a sintered body for which the first laminate and the second laminate are integrated by baking unbaked chips that are made into chips. <P>COPYRIGHT: (C)2012,JPO&INPIT |
