LAMINATE SHEET FOR CIRCUIT BOARD INTEGRATING HEAT SINK WITH FIN, CIRCUIT BOARD INTEGRATING HEAT SINK WITH FIN AND METHOD OF MANUFACTURING LAMINATE SHEET FOR CIRCUIT BOARD INTEGRATING HEAT SINK WITH FIN

摘要

PROBLEM TO BE SOLVED: To provide a laminate sheet for a circuit board integrating a heat sink with fins which exhibits high heat dissipation.

SOLUTION: The laminate sheet for a circuit board integrating a heat sink with fins has a heat sink with fins and a substrate molded integrally and containing a high thermal conductivity filler and a crystalline polymer, an insulating layer formed on the substrate and containing an insulating and thermally conductive filler and a crystalline polymer, and a metal layer formed on the insulating layer. Percentage content of the high thermal conductivity filler in the heat sink with fins and the substrate is 15-65 vol%, and percentage content of the thermally conductive filler in the insulating layer is 15-65 vol%.

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