发明名称 UNDERFILL AGENT AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an underfill agent excellent in high toughness and viscosity characteristics. <P>SOLUTION: The underfill agent includes: a polyphenyl sulfone resin (a) having a weight-average molecular weight of less than 30,000; and an epoxy resin (b), and is characterized in that the content of a solvent (c) is at most 1 wt.%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012025847(A) 申请公布日期 2012.02.09
申请号 JP20100165609 申请日期 2010.07.23
申请人 TORAY IND INC 发明人 TAKEDA KIYOYOSHI;EGUCHI MASUICHI;TOMIKAWA MASAO
分类号 C08L81/06;C08G59/18;C08K3/00;C08L63/00;H01L23/29;H01L23/31 主分类号 C08L81/06
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