| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of filling a conductive material, by which the conductive material can be filled into a through-via hole formed in a sheet material appropriately, and to provide a device for filling the conductive material. <P>SOLUTION: A method of filling a conductive material comprises the step of filling the conductive paste 2 including metal powder and a solvent into a through-via hole 11 formed by piercing a resin film 10. In filling the conductive paste 2, the conductive paste 2 is filled into the through-via hole 11 from above the side of upper surface of the resin film 10 first and in parallel, the solvent and air bubbles included in the conductive paste 2 are sucked and exhausted from the side of the lower surface of the resin film 10. Thereafter, the atmosphere on the side of the upper surface of the resin film 10 is reduced in pressure into a low-pressure atmosphere, which is lower than the atmosphere of an atmospheric pressure. In this condition, the conductive paste 2 is filled into the through-via hole 11 from the side of the upper surface of the resin film 10 again, and the air bubbles included in the conductive paste 2 are exhausted from the side of the upper surface of the resin film 10 by vacuum defoaming. <P>COPYRIGHT: (C)2012,JPO&INPIT |
