发明名称 |
SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A substrate processing apparatus reduces over-heating of a substrate transfer robot and suppresses deterioration of reliability or lifespan of the substrate transfer robot. The substrate processing apparatus includes a transfer chamber having a substrate transferred thereinto under a negative pressure; a process chamber connected to the transfer chamber and configured to heat the substrate; a transfer robot installed in the transfer chamber and configured to transfer the substrate into and out of the process chamber; and a cooling unit configured to cool an inner wall of the transfer chamber. |
申请公布号 |
US2012034570(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201113193220 |
申请日期 |
2011.07.28 |
申请人 |
YASUI TAKESHI;MATSUURA NAOYA;HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
YASUI TAKESHI;MATSUURA NAOYA |
分类号 |
F26B11/02;F27D5/00 |
主分类号 |
F26B11/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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