| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently cleave a glass film with thermal stress without causing cutting failures. <P>SOLUTION: In the apparatus 1 for cleaving a glass film, an initial crack 10, which is formed at a leading edge of a preset cleaving line 7 of a glass film G, is propagated along the preset cleaving line 7 by a thermal stress generated in the glass film G through localized heating applied along the preset cleaving line 7, and cooling of a heated region resulting from the localized heating. At this time, a resin sheet R having higher flexibility than the glass film G is arranged in the cleaving region, and the resin sheet R is floated by blowing a gas on the lower surface of the resin sheet R by a floating means 3. Then, the preset cleaving portion of the glass film G involving the preset cleaving line 7 is lifted and supported while being covered with the floated resin sheet R from below, and in this state, the glass film G is cleaved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
