| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a mark in each of a plurality of chip regions by applying laser beams to a back surface of a semiconductor wafer. <P>SOLUTION: A stage 20 for fixing a wafer 10 comprises: a first member; and a glass plate (a second member) 22. The space between the first member and the glass plate 22 is provided with a first space, a second space arranged around the first space, and a partition member 23 provided in between the first space and the second space. The first member comprises a plurality of vacuum holes (first openings) 25a connected to the first space and a plurality of vacuum holes (second openings) 25b connected to the second space. The wafer 10 is arranged on the stage 20 so that a mark region (a first region) 5a of a back surface 1b of the wafer 10 does not overlap with the vacuum holes 25a and 25b and the partition member 23 when the wafer 10 is fixed on the stage 20. <P>COPYRIGHT: (C)2012,JPO&INPIT |
