| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve mountability of a semiconductor module whose heat needs to be radiated. <P>SOLUTION: Heat sinks 6 and 7 are disposed on both surfaces of a plurality of semiconductor modules 31 and 32, respectively. The heat sink 6 includes a heat exchange part 6b that radiates heat of a semiconductor module 3. The heat sink 7 includes a heat exchange part 7b that radiates heat of the semiconductor module 3. The two heat exchange parts 6b and 7b are disposed adjacent to each other in only one side of the semiconductor modules 31 and 32. Between the semiconductor modules 31 and 32, and a control circuit board 43, there is disposed a plate-like base portion 7a which functions as an electromagnetic shield. Between the heat sinks 6 and 7, there is disposed a holder 8 which contributes to positioning of the semiconductor modules 31 and 32, and wiring work. The heat sink 7 has a connection passage 7c in which there is disposed wires connecting the plurality of semiconductor modules 31 and 32 to power terminals 31e, 31f, 32e, and 32f. <P>COPYRIGHT: (C)2012,JPO&INPIT |
