| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem in the conventional soldering with a large substrate in which: soldering cannot be completed because a printed substrate is curved; soldering jet splatters because molten solder is too close to the printed substrate; and the printed substrate and components are damaged because a nozzle touches a surface-mounted component. <P>SOLUTION: A soldering apparatus comprises: a jet pump 6 for sucking molten solder up from a solder bath 5 where the molten solder is pooled and jetting it; and a nozzle 3 for guiding the sucked molten solder to a proper position for soldering. The soldering apparatus further comprises a wiring 15 for connecting wiring formed in a printed substrate 2 and the soldering bath 5. Electrical conduction in a circuit through the wiring helps a status to be detected in which an X-Y-Z table 7 controls a position of the nozzle or the printed substrate and the molten solder coming out of the nozzle contacts a through hole 12. When the conduction is detected, position control is conducted to adjust the X-Y-Z table at a proper position. <P>COPYRIGHT: (C)2012,JPO&INPIT |
