| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for suspension capable of reducing a differential impedance and enhancing connection reliability. <P>SOLUTION: A substrate 1 for suspension comprises a first insulating layer 10, a spring material layer 11, a first wiring layer 14, and a second wiring layer 15 insulated from the first wiring layer 14. The second wiring layer 15 includes a first conductor portion 15a disposed on the same plane as of the first wiring layer 14 in an implementation region 2, a second conductor portion 15b laminated to the first wiring layer 14 in an intermediate region 4 through a second insulating layer 12 and connected to the first conductor portion 15a, and a third conductor portion 15c disposed on the same plane as of the first wiring layer 14 in an external connection region 3 and connected to the second conductor portion 15b. A conductive connection part 20 for wiring penetrates through the second insulating layer 12 and connects the first conductor portion 15a and the second conductor portion 15b of the second wiring layer 15. <P>COPYRIGHT: (C)2012,JPO&INPIT |
