发明名称 |
Method for Patterning a Semiconductor Surface, and Semiconductor Chip |
摘要 |
A method for patterning a semiconductor surface is specified. A photoresist is applied to an outer area of a second semiconductor wafer. A surface of the photoresist that is remote from the second semiconductor wafer is patterned by impressing a patterned surface of the first wafer into the photoresist. A patterning method is applied to the surface of the photoresist, wherein a structure applied on the photoresist is transferred at least in places to the outer area of the second semiconductor wafer.
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申请公布号 |
US2012032306(A1) |
申请公布日期 |
2012.02.09 |
申请号 |
US201013148631 |
申请日期 |
2010.01.22 |
申请人 |
BAUR ELMAR;BOEHM BERND;HEINDL ALEXANDER;RODE PATRICK;SABATHIL MATTHIAS;OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
BAUR ELMAR;BOEHM BERND;HEINDL ALEXANDER;RODE PATRICK;SABATHIL MATTHIAS |
分类号 |
H01L29/12;H01L21/312 |
主分类号 |
H01L29/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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