SPIN HEAD, CHUCK PIN USED IN THE SPIN HEAD, AND METHOD FOR TREATING A SUBSTRATE WITH THE SPIN HEAD

摘要

A spin head, chuck pin used in the spin head, and method for treating a substrate with the spin head are provided to smoothly supply the processing liquid to the contact area of the chuck pin with the substrate. The substrate processing apparatus(1) comprises the fluid feeding unit(10), the container(20), and the elevating unit(30) and spin head(40). The fluid feeding unit supplies the processing liquid for the board processing or the process gas to the substrate(W). In the processing procedure, the spin head supports and rotates the substrate. The pattern surface of substrate is located in the spin head in order to face the top or the lower part. The elevating unit raises the spin head or the container.