发明名称 APPARATUS FOR CHUCKING A SUBSTRATE
摘要 An apparatus for chucking a substrate is provided to prevent droop of the substrate by contacting a fur member and the substrate in a chucking process or de-chucking process. A substrate chucking device(100) comprises a first plate(110), a second plate(120), and fur members(131, 132, 133, 134). A first plate supports the fur members, and a second plate is arranged on the top of the first plate. The second plate is connected to a conveying unit transferring the substrate. The conveying unit comprises a roller and a driving part operating the roller. The roller moves a second plate along the substrate transfer direction by contacting a peripheral unit of the second plate. The conveying unit transfers the substrate chucked to fur members adhered to the first plate, and the second plate comprises an accommodating groove receiving the fur members.
申请公布号 KR20090035890(A) 申请公布日期 2009.04.13
申请号 KR20070100919 申请日期 2007.10.08
申请人 SEMES CO., LTD. 发明人 AN, KI CHOUL;LEE, SEOK TAE;CHANG, JUNG WON;NOH, IL HO;KWON, OH SUNG
分类号 H01L21/68;H01L21/67 主分类号 H01L21/68
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