PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A wiring circuit board and a manufacturing method thereof are provided to arrange consecutive holes with an average diameter of 1.0μm or less on polytetrafluoroethylene of an insulting layer, thereby preventing penetration of process liquid. CONSTITUTION: A plurality of conductive patterns(2) is arranged on a porous base insulating layer(1) made of expanded polytetrafluoroethylene(ePTFE). Porous polytetrafluoroethylene(PTFE) which has consecutive holes is easily formed using the ePTFE. The conductive pattern is comprised of a wiring pattern or a ground pattern. The conductive pattern has a laminated structure which includes a seed layer(2a) made of a chrome and copper laminated film and a conductive layer(2b) made of copper. A cover insulating layer(3) is arranged on the base insulating layer in order to cover the conductive pattern.