| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of preventing contact between an electronic component and a lead wire connection part, easily improving bendability of an FPC and strength after bent, and improving downsizing and assembly of a package part by making effective use of a space in a solid-state image sensor chip projecting surface. <P>SOLUTION: The device includes: a solid-state imaging device chip 32; an FPC 43, the one end of which is connected to a bonding part 41 of the solid-state image sensor chip 32 and which is bent into a set shape via a plurality of formed bending parts at the back of a back surface 32h of the solid-state image sensor chip 32; and a plurality of electronic components 70 to 72 mounted to the FPC 43. The other end of the FPC 43 bent into a prescribed shape is fixed in a bending direction P1 of the FPC 43 via a bending part most approximate to the other end out of the plurality of bent bending parts by being in contact with an electronic component 71 placed in the direction P2 resisting bending by biasing force. <P>COPYRIGHT: (C)2008,JPO&INPIT |
