| 摘要 |
The invention relates to an LED light source on which a plurality of LED chips (11) is fixed and is electrically connected in series via e.g. soldered joints (25, 18). The invention also relates to LED chips (11) which are suitable to be mounted on the respective substrate (19). The contacting of adjacent LED chips (11) is ensured by their overlap in a region (15), thereby eliminating the need for providing interspaced between the adjacent LED chips for the purpose of their electrical connection as is the case for conventional LED chips. The advantage of the overlapping arrangement is that a high packing density of LED chips can be achieved, thereby making it possible for the LED light source to emit a comparatively homogeneous light field having a comparatively high intensity. |
