发明名称 |
THERMOSETTING EPOXY RESIN COMPOSITION AND USE THEREOF |
摘要 |
<p>A liquid thermosetting epoxy resin composition contains a base resin in combination with a curing agent and a curing accelerator or with a curing catalyst. The base resin includes a cycloaliphatic epoxy compound having at least one alicyclic skeleton and two or more epoxy groups per molecule, and a polyol oligomer having two or more terminal hydroxyl groups. An optical semiconductor device includes an optical semiconductor element sealed by using the liquid thermosetting epoxy resin composition. The composition yields a cured resinous product which is free from curing failure, is optically homogenous, has a low elastic modulus in bending, a high bending strength, a high glass transition temperature, a high optical transparency and is useful for optical semiconductors.</p> |
申请公布号 |
EP1826227(B1) |
申请公布日期 |
2012.02.08 |
申请号 |
EP20050814522 |
申请日期 |
2005.12.09 |
申请人 |
DAICEL CHEMICAL INDUSTRIES, LTD. |
发明人 |
TAKAI, HIDEYUKI;HIRAKAWA, HIROYUKI |
分类号 |
C08G59/40;C08L63/00;C08L67/00;C08L69/00;H01L23/29;H01L23/31 |
主分类号 |
C08G59/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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