| 发明名称 |
DIRECT OVERMOLDING |
| 摘要 |
Disclosed is a curable composition comprising an epoxy resin and a filler composition, a cured product obtained by curing said curable composition as well as the use of the cured products as electrically insulating construction material for electrical or electronic components. |
| 申请公布号 |
EP2414444(A1) |
申请公布日期 |
2012.02.08 |
| 申请号 |
EP20100706200 |
申请日期 |
2010.02.24 |
| 申请人 |
HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH |
发明人 |
BEISELE, CHRISTIAN;GRINDLING, JOSEF;BAER, DANIEL |
| 分类号 |
C08K3/34;C08K3/36;C08L63/00;H02B13/00 |
主分类号 |
C08K3/34 |
| 代理机构 |
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代理人 |
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| 地址 |
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