Semiconductor Package and Method of Manufacturing the same

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to maintain fixed resin injection pressure by not discharging resin to the outside of the semiconductor package. CONSTITUTION: A substrate(150) in which an electronic component(170) is mounted is arranged on the upper surface of a lower mold(130). An upper mold(110) is formed in order to have a stepped structure according to the height of the electric component mounted on the substrate. An air vent part(120a) is located between the upper mold and the lower mold. The air vent part is formed with a slope of a predetermined angle in an edge part of the upper mold. An insulator(190) is arranged on the upper surface of the substrate in which the electronic component is mounted.