| 摘要 |
A pressing apparatus of a lead frame of a semiconductor package is provided to reduce a manufacturing cost, a driving cost, and a maintenance cost of a lead frame apparatus by lengthening a structural lifetime of an operating unit. A pressing apparatus of a lead frame of a semiconductor package includes a stationary platen(210), a guide bar(225), a movable platen(220), a movable block(250), a crank shaft(230), a driving unit, a connecting rod(240), and an auxiliary elevating unit. The stationary platen is fixed on the base(200). A lower mold(10) is loaded on an upper part of the stationary platen. The guide bar is installed movably through the stationary platen. The movable platen is movably coupled with the guide bar at an upper part of the stationary platen. An upper mold(20) is installed at a lower part of the movable platen. The movable block is movably coupled with the guide bar. The crank shaft is installed horizontally at a lower part of the stationary platen. The driving unit rotates the crank shaft. Both sides of the connecting rod are connected to the crank shaft and the movable block. The connecting rod is used for moving linearly the movable block according to the rotation of the crank shaft. The connecting rod is used for elevating the upper mold of the movable platen in a constant press stroke. The auxiliary elevating unit moves the movable platen in the press stroke and more. The auxiliary elevating unit includes an actuator(245) and a guiding unit. |
