发明名称 |
PROCESS FOR MANUFACTURING SUBSTRATES WITH DETACHMENT OF A TEMPORARY SUPPORT, AND ASSOCIATED SUBSTRATE |
摘要 |
<p>A process for producing a substrate is described. The process includes providing an assembly having a first layer weakly bonded to a temporary support at an interface therebetween. At least a portion of the first layer is selectively etched substantially to the interface to create an etched zone. A second layer is then bonded to un-etched portions of the first layer to cover the etched zone and to form a closed cavity. The first layer is detached from the temporary support at the weak bond by providing a raised pressure in the cavity.</p> |
申请公布号 |
KR100917941(B1) |
申请公布日期 |
2009.09.21 |
申请号 |
KR20047017490 |
申请日期 |
2003.04.30 |
申请人 |
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发明人 |
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分类号 |
H01L21/762;H01L21/00;H01L21/02;H01L27/12;H01L31/18;H01L33/00 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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