| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive resin composition having suppressed temporal changes of viscosity and suppressed deposition of a conductive powder and excellent in conductivity, adhesiveness and workability and an electronic component device high in reliability using the conductive resin composition.SOLUTION: There are provided a conductive resin composition containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a conductive powder, (E) fine silica having hydrophobicity by a methanol wettability of 40 to 60% as essential contents and an electronic component device using the same.SELECTED DRAWING: Figure 1 |
