发明名称 CONDUCTIVE ADHESIVE FOR ELECTRONIC COMPONENT AND CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a conductive adhesive for electronic component having high adhesiveness, good in conductivity and capable of low ESR of a capacitor and reducing raw material costs and a high performance and high reliability capacitor using such conducive adhesive.SOLUTION: A conductive adhesive for an electronic component contains (A) an epoxy resin, (B) a phenol resin curing agent, (C) a scaly silver coated copper powder, (D) a dendritic silver coated copper powder and (E) a curing accelerator. The total content of the (C) component and the (D) component is 70 to 85 mass% and a mass ratio of the contents of the (C) component and the (D) component is 95:5 to 45:55.SELECTED DRAWING: None
申请公布号 JP2016089038(A) 申请公布日期 2016.05.23
申请号 JP20140225257 申请日期 2014.11.05
申请人 KYOCERA CHEMICAL CORP 发明人 FUJIMORI YOSHIE
分类号 C09J163/00;C09J9/02;C09J11/04;H01B1/00;H01B1/22;H01G9/04;H01G11/28 主分类号 C09J163/00
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