Solution for surface treatment

摘要

A laminate (1) is made by adhering at least one metal layer (3) selected from the group consisting of copper and a copper alloy to a resin layer (2). A coating film (4) of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on a surface of the metal layer (3), and the metal layer (3) adheres to the resin layer (2) via the coating film (4) of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate. <IMAGE>