ADHESIVE FOR DIE ADHESION

摘要

PROBLEM TO BE SOLVED: To provide an adhesive for die adhesion that makes it possible to produce a semiconductor package with high reliability even if a heating time in a step other than sealing becomes long to increase the thermal history.SOLUTION: An adhesive for die adhesion comprises an epoxy thermosetting component and a curing catalyst, and the curing catalyst is a phosphine curing catalyst. The adhesive for die adhesion comprises at least one of epoxy resin or phenolic resin as the epoxy thermosetting component, and the epoxy resin or phenolic resin has an optionally substituted biphenylene group.SELECTED DRAWING: None