| 摘要 |
PROBLEM TO BE SOLVED: To accurately produce an electroforming component, in which a silicon part is embedded to an optional depth, with a simple method.SOLUTION: The method is configured to: coat a photoresist layer 2 to a surface of a silicon substrate 1, open an electroforming area, then perform patterning so that photoresist parts 2a, 2b are formed in an island-state in the opening 2c, then, the silicon substrate 1 is subjected to etching for forming a groove 1c with the photoresist parts as masks, then, the photoresist layer 2 is removed. Then a conductive film 3 is formed on the surface of the silicon substrate 1 containing inside of the groove 1c, then a photoresist layer 4 is formed thereon, then, patterning is performed so as to form an opening 4a corresponding to a planar shape of an electroforming component. Then, by electroforming in which the conductive film 3 is one electrode, an electroforming member 6 is deposited on the conductive film 3 in the opening 4a, and then an upper face of the electroforming member 6 is made smooth. Then, the silicon substrate 1 is removed to a bottom face of the groove 1c, and the second photoresist layer 4 also is removed, then, the electroforming component 10 in which silicon parts 1a, 1b being parts of the silicon substrate 1 are embedded into an electroforming member 6' is taken out.SELECTED DRAWING: Figure 1 |
