| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board which allows for low profile, while ensuring a space between the surface of an uppermost insulation layer and an electronic component.SOLUTION: A method of manufacturing a wiring board where a plurality of insulation layers are laminated, and having a mounting area of an electronic component on the surface of an uppermost insulation layer has a step for forming a first metal layer becoming a connection terminal with an electronic component in the mounting area on the surface of a green sheet becoming the uppermost insulation layer, a step for forming a second metal layer on the periphery of each side of green sheet surface becoming the uppermost insulation layer surrounding the mounting area, and a step for pressing the first metal layer by means of a first member, and pressing the second metal layer by means of a second member harder than the first member.SELECTED DRAWING: Figure 1 |
