发明名称 BACKSIDE ILLUMINATED IMAGE SENSOR HAVING DEEP LIGHT REFLECTIVE TRENCHES
摘要 <p>An array of pixels is formed using a substrate having a frontside and a backside that is for receiving incident light. Each pixel typically includes metallization layers included in the frontside of the substrate, a photosensitive region formed in the backside of the substrate, and a trench formed around the photosensitive region in the backside of the substrate. The trench causes the incident light to be directed away from the trench and towards the photosensitive region.</p>
申请公布号 EP2245663(B1) 申请公布日期 2012.02.08
申请号 EP20080872124 申请日期 2008.12.17
申请人 OMNIVISION TECHNOLOGIES, INC. 发明人 VENEZIA, VINCENT;TAI, HSIN-CHIH;MAO, DULI;MANABE, SOHEI;RHODES, HOWARD, E.;QIAN, WEI, DONG
分类号 H01L27/146 主分类号 H01L27/146
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