Circuit substrate and method of forming circuit pattern

摘要

With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region.

主权项

1. A method of forming a circuit pattern, comprising:
with moving a substrate unit on which a liquid-repellent region having a liquid repellency to conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed, and a nozzle relatively in one direction, discharging the conductive ink in a belt-like manner to a region including the liquid-repellent region and the lyophilic region of the substrate unit out of a slit extending long in a lateral direction orthogonal to the one direction and formed to the nozzle.