| 摘要 |
Disclosed is a sensor device (10) comprising a substrate (100) carrying a sensing element (110), and a metallization stack on said substrate for providing interconnections to said sensing element, the metallization stack comprising a plurality of patterned metal layers (130a-d) separated by insulating layers (120a-d), wherein a first metal layer (130c) comprises an electrode portion (16) conductively connected to the sensing element, and a further metal layer (130d) facing the first metal layer comprises a reference electrode portion (18), the electrode portion and the reference electrode portion being separated by a fluid channel (14) accessible from the top of the metallization stack. A method of manufacturing such a sensor device is also disclosed. |
