发明名称 部品供給装置および部品位置認識方法
摘要 PROBLEM TO BE SOLVED: To provide a component supply device and a component position recognition method which can easily, reliably and accurately detect a circumferential position of a wafer and accurately recognize a position of a wafer cut component.SOLUTION: A component supply device 20 has: a wafer illumination device 80 which is mounted on a second movement device 71 of a component push-up device 70 and irradiates a wafer U transferred to a component supply position A with light in a wide angle from below; and a camera 39 which is attached to a first movement device 31 of a component mounting device 30 and takes an image of a part of a circumference of the wafer U. Therefore a circuit and the like formed on a surface of the wafer U are not taken in the image and the wafer U is reflected as a shadow. Thereby the circumferential position of the wafer U can easily, reliably and accurately be detected and a position of a wafer cut component P can accurately be recognized. Consequently, the component supply device 20 can be reduced at cost and in size because a conventional optical sensor is unnecessary.
申请公布号 JP5954969(B2) 申请公布日期 2016.07.20
申请号 JP20110260141 申请日期 2011.11.29
申请人 富士機械製造株式会社 发明人 大池 博史;柘植 邦明;杉山 健二;岩瀬 友則
分类号 H01L21/67;H01L21/68;H05K13/04;H05K13/08 主分类号 H01L21/67
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