| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the concentration of stress in solder at the corner of a lead part exposing from a mold resin when a leadless type mold package is mounted by soldering. <P>SOLUTION: The mold package 100 is bonded to a substrate 200 on faces 12b and 12c exposing from a mold resin 30 at a lead part 12 by means of solder 300. In the exposed faces 12b and 12c in the lead part 12, a corner 12d that is formed by an end face 12c exposing from the end face 33 of the mold resin 30 and a lower face 12b exposing from the lower face 32 of the mold resin 30 is recessed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
