发明名称 Method of forming a contact structure
摘要 An insulation layer may be formed on an object having a contact region. The insulation layer may be partially etched to form an opening exposing the contact region. A material layer including silicon and oxygen may be formed on the exposed contact region. A metal layer may be formed on the material layer including silicon and oxygen. The material layer including silicon and oxygen may be reacted with the metal layer to form a metal oxide silicide layer at least on the contact region. A conductive layer may be formed on the metal oxide silicide layer to fill up the opening.
申请公布号 US8110499(B2) 申请公布日期 2012.02.07
申请号 US20090437390 申请日期 2009.05.07
申请人 KANG DAE-HYUK;KIM YOUNG-HOO;HONG CHANG-KI;LEE KUN-TACK;LEE JAE-DONG;EOM DAE-HONG;HAN JEONG-NAM;SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG DAE-HYUK;KIM YOUNG-HOO;HONG CHANG-KI;LEE KUN-TACK;LEE JAE-DONG;EOM DAE-HONG;HAN JEONG-NAM
分类号 H01L21/44 主分类号 H01L21/44
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