| 摘要 |
<p>PURPOSE: A method for transferring a wafer using a wafer transfer robot is provided to improve the efficiency of a semiconductor manufacturing process by loading/unloading two wafers between buffer units through a wafer transfer robot including two transfer devices. CONSTITUTION: A first transfer device(20) including a first fixed part(21) is transferred to a first direction. A first wafer is unloaded to a buffer part(40) by transferring a main body part(10) to the vertical direction of the first direction. The first transfer device is transferred to a second direction which is opposite to the first direction. A second transfer device(30) including a second fixing part(21) is transferred to the first direction. A second wafer is unloaded on the buffer part by transferring the main body part to the vertical direction of the first direction. The second transfer device is transferred to the second direction.</p> |
