发明名称 |
Semiconductor device having a plurality of repair fuse units |
摘要 |
A semiconductor device includes a plurality of stacked semiconductor chips; and a plurality of through-silicon vias (TSVs) including first TSVs and redundant TSVs and configured to commonly transfer a signal to the plurality of stacked semiconductor chips. At least one of the semiconductor chips includes a plurality of repair fuse units configured to store defect information as to at least one defect of the TSVs; and a plurality of latch units allocated to the respective TSVs and configured to store a plurality of signals indicating at least one TSV defect and outputted from the plurality of repair fuse units.
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申请公布号 |
US8110892(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20090649452 |
申请日期 |
2009.12.30 |
申请人 |
LEE JEONG-WOO;LEE HYUNG-DONG;SHIN SANG-HOON;CHOI HYANG-HWA;HYNIX SEMICONDUCTOR INC. |
发明人 |
LEE JEONG-WOO;LEE HYUNG-DONG;SHIN SANG-HOON;CHOI HYANG-HWA |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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