发明名称 |
Light emitting device and method for manufacturing same |
摘要 |
A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate; forming a dielectric film on a second surface side opposite to the first surface of the multilayer body, the dielectric film having a first and second openings on a p-side electrode and an n-side electrode provided on the second surface; forming a seed metal on the dielectric film and an exposed surface of the first and second openings; forming a p-side metal interconnect layer and an n-side metal interconnect layer on the seed metal; separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal, which is provided between the p-side metal interconnect layer and the n-side metal interconnect layer; and forming a resin in a space from which the seed metal is removed. |
申请公布号 |
US8110421(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20090505759 |
申请日期 |
2009.07.20 |
申请人 |
SUGIZAKI YOSHIAKI;SHIBATA HIDEKI;ISHIKAWA MASAYUKI;TAMURA HIDEO;KOMATSU TETSURO;KOJIMA AKIHIRO;KABUSHIKI KAISHA TOSHIBA |
发明人 |
SUGIZAKI YOSHIAKI;SHIBATA HIDEKI;ISHIKAWA MASAYUKI;TAMURA HIDEO;KOMATSU TETSURO;KOJIMA AKIHIRO |
分类号 |
H01L21/66;H01L33/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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