发明名称 |
Inline low-damage automated failure analysis |
摘要 |
A system and method for failure analysis of devices on a semiconductor wafer is disclosed. The present invention comprises the use of an inline focused ion beam milling tool to perform milling and image capturing of cross sections of a desired inspection point. The inspection points are located by identifying at least one fiducial that corresponds to an X-Y offset from the desired inspection point. The fiducials are recognized by a computer vision system. By automating the inspection process, the time required to perform the inspections is greatly reduced. |
申请公布号 |
US8111903(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20080238602 |
申请日期 |
2008.09.26 |
申请人 |
HERSCHBEIN STEVEN B.;GEIGER, JR. RONALD C.;GU GEORGE Y.;GLUSCHENKOV OLEG;OUYANG XU;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HERSCHBEIN STEVEN B.;GEIGER, JR. RONALD C.;GU GEORGE Y.;GLUSCHENKOV OLEG;OUYANG XU |
分类号 |
G06K9/00 |
主分类号 |
G06K9/00 |
代理机构 |
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代理人 |
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地址 |
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