发明名称 |
Chip package and manufacturing method thereof |
摘要 |
A chip package including at least a shielding layer for better electromagnetic interferences shielding is provided. The shielding layer disposed over the top surface of the laminate substrate can protect the chip package from the underneath EMI radiation. The chip package may further include another shielding layer over the molding compound of the chip package.
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申请公布号 |
US8110902(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20090388761 |
申请日期 |
2009.02.19 |
申请人 |
EUN YOUNGHYO;KIM DUKMAN;ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
EUN YOUNGHYO;KIM DUKMAN |
分类号 |
H01L23/552 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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