发明名称 |
Package substrate with a conductive connecting pin |
摘要 |
A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad 16 for securing the conductive connecting pin is provided for the package substrate 310. The pad 16 is covered with an organic resin insulating layer 15 having an opening 18 through which the pad 16 is partially exposed to the outside. The conductive connecting pin 100 is secured to the pad exposed to the outside through the opening with a conductive adhesive agent 17 so that solution of the conductive connecting pin 100 from the substrate occurring, for example when mounting is performed is prevented. |
申请公布号 |
US8110917(B2) |
申请公布日期 |
2012.02.07 |
申请号 |
US20090581205 |
申请日期 |
2009.10.19 |
申请人 |
HIROSE NAOHIRO;ITO HITOSHI;IWATA YOSHIYUKI;KAWADE MASANORI;YAZU HAJIME;IBIDEN CO., LTD. |
发明人 |
HIROSE NAOHIRO;ITO HITOSHI;IWATA YOSHIYUKI;KAWADE MASANORI;YAZU HAJIME |
分类号 |
H01L23/48;H01L23/498;H05K1/11;H05K3/28;H05K3/32;H05K3/34;H05K3/38;H05K3/46 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|